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  • 18707901177
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    Interconnect Ribbon is made from TU1 copper after rolling and hot dipping process by automatic

    tinning machine. It can reduce the cell fragment rate.

    名称:Interconnect Ribbon
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    1. Tin coated copper ribbon
    1.1 Resistivity: ≤0.023Ωm㎡ / m.
    1.2 Dimensions: Thickness tolerance ± 0.01mm, width tolerance ± 0.1mm
    1.3 sickle bending: ≤5mm / 1000mm.
    1.4 Yield Strength: soft state ≤100Mpa, super-soft state ≤70Mpa.
    1.5 Tensile strength: ≤250 Mpa.
    1.6 Elongation: ≥25%.
    1.7 Reliability Test:neutral salt spray test ≥168 hours, double test ≥2000 85 hours.
    2. Copper base
    2.1 Material: TU0 / CU-OF≥99.99%, TU1 / CU-OF≥99.97%, T2 / CU-ETP≥99.9%, conductivity ≥100% IACS.
    2.2 Resistivity: TU / CU-OF≤0.0165Ωm㎡ / m, T2 / CU-ETP≤0.0172Ωm㎡ / m.
    2.3 Hardness: ≤47HV.
    2.4 Status: Soft-state or super soft state.
    2.5 Elongation: ≥30%.
    2.6 Thickness tolerance: ± 0.003mm, width tolerance: ± 0.05mm.
    3. Soldering
    3.1 leaded type
    (1) 63% Sn37% Pb mp 183 ℃
    (2) 60% Sn40% Pb mp 191 ℃
    3.2 lead-free (environmentally friendly)
    (1) Sn-Ag series mp 221 ℃
    (2) Sn-Ag-Cu series mp 217 ~ 219 ℃
    (3) Sn-Cu series mp 227 ℃
    3.3 lead-silver type
    (1) 62% Sn36% Pb2% Ag mp179 ℃
    (2) 60% Sn39.5% Pb0.5% Ag mp179 ℃
    Can be customized according to customer requirements tin material.
    4. Flux
    4.1 leaded type
    4.2 lead-free (environmentally friendly)
    Fluxes are neutral solution, halogen-free.